The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Jun. 04, 2020
Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventors:

Tomoyuki Ikeda, Ogaki, JP;

Shigemitsu Kunikane, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/025 (2013.01); H05K 1/024 (2013.01); H05K 1/0219 (2013.01); H05K 1/0242 (2013.01); H05K 1/115 (2013.01); H05K 3/108 (2013.01); H05K 3/18 (2013.01); H05K 3/4673 (2013.01); H05K 1/0298 (2013.01); H05K 1/11 (2013.01); H05K 3/4661 (2013.01); H05K 2201/0391 (2013.01); H05K 2201/096 (2013.01);
Abstract

A wiring substrate includes a substrate including conductor layers and core insulating layers, and a laminate including insulating layers and conductor layers such that the conductor layers include first layer including first line pattern. The laminate includes first strip line including the first pattern, a pair of interlayer insulating layers sandwiching the first pattern, and a pair of conductor layers sandwiching the interlayer layers, the conductor layers in the substrate include second layer including second line pattern such that the substrate includes second strip line including the second pattern, a pair of core insulating layers sandwiching the second pattern, and a pair of conductor layers sandwiching the core insulating layers, and the pair of core insulating layers is thicker than the pair of interlayer layers, the second pattern is thicker than the first pattern, and line width of the second pattern is larger than line width of the first pattern.


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