The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2022
Filed:
Jul. 29, 2020
Ibiden Co., Ltd., Ogaki, JP;
Shigemitsu Kunikane, Ogaki, JP;
Tomoyuki Ikeda, Ogaki, JP;
IBIDEN CO., LTD., Ogaki, JP;
Abstract
A wiring substrate includes a multilayer core substrate including a core layer, core conductor layers, and core insulating layers, a first laminate formed on first surface of the substrate and including insulating layers and conductor layers such that each insulating layer includes resin without reinforcing material, and a second laminate formed on second surface of the substrate and including insulating layers and conductor layers such that each insulating layer includes resin without reinforcing material. The multilayer core substrate includes through-hole conductors penetrating through the core layer, and via conductors formed on the through-hole conductors and penetrating through the core insulating layers such that the through-hole conductors and via conductors connect outermost core conductor layers on the first and second surface sides, each of the core layer and core insulating layers includes insulating resin including reinforcing material, and the core layer has thickness greater than thickness of each core insulating layer.