Aurora, IL, United States of America

Shi-Wei Cheng


Average Co-Inventor Count = 7.0

ph-index = 2

Forward Citations = 14(Granted Patents)


Location History:

  • Taoyuan, TW (2016)
  • Aurora, IL (US) (2017)

Company Filing History:


Years Active: 2016-2017

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2 patents (USPTO):Explore Patents

Title: Innovations by Shi-Wei Cheng in Polishing Technology

Introduction

Shi-Wei Cheng is an accomplished inventor based in Aurora, IL, known for his contributions to the field of polishing technology. With a total of 2 patents, Cheng has developed innovative solutions that enhance the efficiency and effectiveness of chemically-mechanical polishing processes.

Latest Patents

Cheng's latest patents include a "Polishing pad with offset concentric grooving pattern and method for polishing a substrate therewith." This invention provides a polishing pad designed for chemically-mechanically polishing a substrate. The polishing pad features a plurality of grooves, including at least a first plurality of concentric grooves with a unique center of concentricity, and a second plurality of concentric grooves with a different center of concentricity. Notably, the first and second centers of concentricity do not coincide, and the axis of rotation of the polishing pad is not aligned with either center. Additionally, the grooves do not form a continuous spiral pattern, and the polishing surface avoids a mosaic groove pattern.

Another significant patent is the "CMP polishing pad having edge exclusion region of offset concentric groove pattern." This invention also focuses on a polishing pad and its method of use for chemically-mechanically polishing a substrate. The design includes a grooved region and an exclusion region, which is located adjacent to the circumference of the polishing pad and is devoid of grooves.

Career Highlights

Cheng is currently employed at Cabot Microelectronics Corporation, where he continues to innovate in the field of polishing technology. His work has significantly contributed to advancements in the industry, making processes more efficient and effective.

Collaborations

Cheng has collaborated with notable coworkers, including Ching-Ming Tsai and Jia-Cheng Hsu, who have also contributed to the development of innovative polishing technologies.

Conclusion

Shi-Wei Cheng's contributions to polishing technology through his patents demonstrate his commitment to innovation and excellence in the field. His work continues to influence the industry and improve the processes involved in substrate polishing.

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