Taipei, Taiwan

Sheng-Wei Hung


Average Co-Inventor Count = 6.2

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2019-2020

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3 patents (USPTO):Explore Patents

Title: Innovations of Sheng-Wei Hung

Introduction

Sheng-Wei Hung is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of Micro-Electro-Mechanical Systems (MEMS) integrated with semiconductor devices. With a total of 3 patents to his name, his work continues to influence advancements in this area.

Latest Patents

Sheng-Wei Hung's latest patents include a method for fabricating a MEMS device integrated with a semiconductor integrated circuit. This innovative method involves providing a semiconductor substrate that comprises a MOS transistor. A MEMS device is then formed over the MOS transistor, which includes a bottom electrode in a second topmost metal layer, a diaphragm in a pad metal layer, and a cavity situated between the bottom electrode and the diaphragm. Another notable patent is for a semiconductor device that features an integrally constructed MEMS device above the MOS transistor, showcasing similar structural elements as his previous patent.

Career Highlights

Sheng-Wei Hung is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His work at this organization has allowed him to further his research and development efforts in MEMS technology, contributing to the company's innovative projects.

Collaborations

Throughout his career, Sheng-Wei Hung has collaborated with notable colleagues such as Tsong-Lin Shen and Chin-Tsai Chang. These partnerships have fostered a collaborative environment that enhances the innovation process.

Conclusion

Sheng-Wei Hung's contributions to the field of semiconductor technology through his patents and collaborations highlight his role as a key innovator. His work continues to pave the way for advancements in MEMS integration, showcasing the importance of innovation in technology.

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