Sheng-Chieh Liu

Title: Innovations by Sheng-Chieh Liu in Wafer Backside Alignment

Introduction

Sheng-Chieh Liu is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly in wafer backside alignment technologies. With a total of 2 patents, Liu's work is instrumental in enhancing the precision and efficiency of semiconductor fabrication processes.

Latest Patents

Liu's latest patents include a method and system for wafer backside alignment. This innovation discloses a method involving zero mark patterning on the front side of a substrate. A plurality of layers are deposited on the front side, and the wafer is flipped over with the backside facing up. A through wafer etching is then performed from the backside to an etch stop layer deposited over the front side of the substrate. Another significant patent focuses on wafer backside alignment overlay accuracy. This method includes forming a buried layer on the front side of a wafer, followed by a conductive layer and the patterning of test structures. The process involves etching through the wafer from the backside to perform an alignment process, determining overlay accuracy with the second test structure.

Career Highlights

Sheng-Chieh Liu is currently employed at Taiwan Semiconductor Manufacturing Company Ltd. His work at this leading semiconductor manufacturer has allowed him to develop and refine innovative techniques that contribute to the advancement of the industry.

Collaborations

Liu has collaborated with notable coworkers, including Tzu-Yang Wu and Chia-Hung Kao. These partnerships have fostered a collaborative environment that enhances the development of cutting-edge technologies in semiconductor manufacturing.

Conclusion

Sheng-Chieh Liu's contributions to wafer backside alignment represent a significant advancement in semiconductor technology. His innovative patents and collaborative efforts continue to shape the future of the industry.