The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2009
Filed:
Apr. 24, 2006
Sheng-chieh Liu, Taichung, TW;
Chia-hung Kao, Hsin-Chu, TW;
Tzu-yang Wu, Hsin-Chu, TW;
Sheng-liang Pan, Hsin-Chu, TW;
Yuan-bang Lee, Miaoli County, TW;
Sheng-Chieh Liu, Taichung, TW;
Chia-Hung Kao, Hsin-Chu, TW;
Tzu-Yang Wu, Hsin-Chu, TW;
Sheng-Liang Pan, Hsin-Chu, TW;
Yuan-Bang Lee, Miaoli County, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Disclosed is a method and a system for wafer backside alignment. A zero mark patterning on front side of a substrate. A plurality of layers are deposited on the front side of the substrate. The wafer is flipped over with backside of the substrate facing up, and a through wafer etching is performed from the backside to an etch stop layer deposited over the front side of the substrate.