Hsinchu, Taiwan

Shaulin Shue


Average Co-Inventor Count = 1.8

ph-index = 6

Forward Citations = 90(Granted Patents)


Company Filing History:


Years Active: 1997-2007

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8 patents (USPTO):Explore Patents

Title: Innovations of Shaulin Shue

Introduction

Shaulin Shue is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patents. With a total of 8 patents, Shue has established himself as a key figure in advancing electrochemical plating methods.

Latest Patents

Among his latest patents are two notable inventions. The first is related to ECP polymer additives and a method for reducing overburden and defects in electrochemical plating. This patent discloses polymer additives that optimize gap fill capability while reducing metal overburden in electroplated metals. The additives are incorporated into an electrochemical plating bath solution and include low cationic charge density co-polymers with aromatic and amine functional group monomers. The second patent focuses on copper electromigration inhibition through copper alloy formation. This method outlines the steps for forming a copper structure, including the formation of a Sn layer and a copper seed layer, which ultimately leads to the creation of a CuSn alloy.

Career Highlights

Shaulin Shue is currently employed at Taiwan Semiconductor Manufacturing Company Ltd. His work has been instrumental in developing advanced materials and methods that enhance the performance and reliability of semiconductor devices. His innovative approaches have garnered attention in the industry and contributed to the ongoing evolution of semiconductor technology.

Collaborations

Shue has collaborated with several talented individuals in his field, including Chung-Liang Chang and Chen-Hua Douglas Yu. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Shaulin Shue's contributions to the field of semiconductor technology through his patents and collaborations highlight his innovative spirit and dedication to advancing the industry. His work continues to influence the development of new materials and methods in electrochemical plating.

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