Shao-Yun Chen

Title: Innovations of Shao-Yun Chen

Introduction

Shao-Yun Chen is a prominent inventor based in Tao-Yuan, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of four patents. His work focuses on advanced package structures that enhance the performance and reliability of electronic devices.

Latest Patents

One of Shao-Yun Chen's latest patents is titled "Package structure including IPD and method of forming the same." This patent describes a package structure that includes a die, an encapsulant that laterally encapsulates the die, and a first RDL structure disposed on both the encapsulant and the die. The invention features an IPD that is placed on the first RDL structure, along with an underfill layer. The IPD consists of a substrate, a first connector on one side that is electrically connected to the first RDL structure, and a guard structure on the opposite side that surrounds a connector region. Additionally, a second connector is located within the connector region and is electrically connected to a conductive via embedded in the substrate. The underfill layer is designed to fill the space between the first side of the IPD and the first RDL structure, while being separated from the connector region by the guard structure.

Career Highlights

Shao-Yun Chen is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to innovate in semiconductor technology. His expertise in package structures has positioned him as a key contributor to advancements in the industry.

Collaborations

Some of his notable coworkers include Li-Hsien Huang and An-Jhih Su, who collaborate with him on various projects within the company.

Conclusion

Shao-Yun Chen's contributions to semiconductor packaging through his innovative patents demonstrate his significant role in advancing technology in this field. His work continues to influence the development of reliable electronic devices.