The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2017
Filed:
Sep. 20, 2016
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A chip package structure is provided. The chip package structure includes a substrate. The chip package structure includes a chip package stacked over the substrate. The chip package structure includes first conductive bumps arranged between and in direct contact with the chip package and the substrate providing a clearance. The chip package structure includes a chip structure having a first face and an opposing second face arranged in the clearance between the chip package and the substrate and adjacent to the first conductive bumps. The chip structure contains at least one chip. The chip package structure includes a solder cap connecting the first face of the chip structure and the chip package. The chip package structure includes a second conductive bump connecting the second face of the chip structure and the substrate.