SeungJae Lee

Title: The Innovative Contributions of SeungJae Lee

Introduction

SeungJae Lee is a prominent inventor based in Pasadena, CA, known for his significant contributions to the field of semiconductor packaging. With a total of seven patents to his name, he has made remarkable advancements in technology that enhance the performance and efficiency of integrated circuits.

Latest Patents

One of SeungJae Lee's latest patents is focused on the packaging of three-dimensional integrated circuits through encapsulation with copper posts and a double-sided redistribution layer. This innovative semiconductor package features a top surface and a bottom surface, incorporating a semiconductor die with a front surface, back surface, and multiple edges. The design includes a mold compound on the back surface and edges of the die, along with a plurality of first conductive elements extending through the mold compound to the top surface of the package, and second conductive elements on the bottom surface. Another notable patent is related to a through mold via frame, which consists of a sheet of epoxy mold compound with several holes extending through it, and a plurality of conductive elements that pass through each respective hole.

Career Highlights

Throughout his career, SeungJae Lee has worked with leading companies in the technology sector, including Rockley Photonics Limited and Apple Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to the advancement of semiconductor technology.

Collaborations

SeungJae Lee has collaborated with notable professionals in his field, including Brett Sawyer and David Arlo Nelson. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

SeungJae Lee's work as an inventor has significantly impacted the semiconductor industry through his innovative patents and collaborations. His contributions continue to shape the future of technology, making him a key figure in the field of integrated circuits.