The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Jul. 10, 2020
Applicant:
Rockley Photonics Limited, Altrincham, GB;
Inventors:
Seungjae Lee, Pasadena, CA (US);
Brett Sawyer, Pasadena, CA (US);
Gerald Cois Byrd, Shadow Hills, CA (US);
Assignee:
Rockley Photonics Limited, Altrincham, GB;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); G02B 6/42 (2006.01); G02B 6/43 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); G02B 6/428 (2013.01); G02B 6/43 (2013.01); H01L 21/486 (2013.01); H01L 23/3128 (2013.01); H05K 1/0274 (2013.01); H05K 3/4069 (2013.01); H05K 2201/10378 (2013.01);
Abstract
A via frame. In some embodiments, the via frame includes: a sheet of epoxy mold compound, having a plurality of holes each extending through the sheet of epoxy mold compound, and a plurality of conductive elements, each extending through a respective one of the holes.