The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Dec. 14, 2020
Applicant:
Rockley Photonics Limited, Altrincham, GB;
Inventors:
Seungjae Lee, Pasadena, CA (US);
Brett Sawyer, Pasadena, CA (US);
David Arlo Nelson, Fort Collins, CO (US);
Assignee:
Rockley Photonics Limited, Altrincham, GB;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); G01F 1/00 (2022.01); G02B 1/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H10D 84/00 (2025.01); H10D 84/03 (2025.01); H10D 88/00 (2025.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/293 (2013.01); H01L 23/3107 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 23/538 (2013.01); H10D 84/00 (2025.01); H10D 84/038 (2025.01); H10D 88/01 (2025.01); G01F 1/00 (2013.01); G02B 1/00 (2013.01);
Abstract
A semiconductor package. In some embodiments, the package has a top surface and a bottom surface, and includes: a semiconductor die having a front surface, a back surface, and a plurality of edges; a mold compound, on the back surface of the die and the edges of the die; a plurality of first conductive elements extending through the mold compound on the back surface of the die to the top surface of the package; and a plurality of second conductive elements on the bottom surface of the package.