The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2022
Filed:
Nov. 20, 2019
Applicant:
Rockley Photonics Limited, London, GB;
Inventors:
Assignee:
Rockley Photonics Limited, Altrincham, GB;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 21/78 (2013.01); H01L 23/3121 (2013.01);
Abstract
A system integrating a fan-out package, including a first semiconductor die, with a second semiconductor die. In some embodiments the fan-out package includes the first semiconductor die, a mold compound, covering the first semiconductor die on at least two sides, and an electrical contact, on a lower surface of the first semiconductor die. The fan-out package may have a rabbet along a portion of a lower edge of the fan-out package.