This inventor holds 4 USPTO granted patents and 5 published patent applications. Top assignees: Samsung Electro-Mechanics Co., Ltd., Samsung Electronics Co., Ltd.. Active years: 2013-2020.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Gyunggi-do, KR (2013)
- Hwaseong, KR (2015)
- Suwon-Si, KR (2019 - 2020)
Company Filing History:
3 out of 7,633 
1 out of 132,108 
Years Active: 2013-2020
Title: Seung Wan Shin: Innovator in Semiconductor Packaging
Introduction
Seung Wan Shin is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His innovative designs have advanced the technology used in electronic devices.
Latest Patents
One of his latest patents is a fan-out semiconductor package that features a frame with wiring layers and a dummy layer. This package includes a recessed portion on the bottom surface where a stopper layer is placed. A semiconductor chip is positioned in the recessed area, with its inactive surface facing the stopper layer. The design incorporates a first interconnect structure on the connection pad and a second interconnect structure on the outermost wiring layer. Additionally, a dummy structure is placed on the dummy layer, and an encapsulant surrounds various components, ensuring functionality and protection. Another notable patent describes a fan-out semiconductor package that consists of two semiconductor chips, each with their own active surfaces and connection pads. This design includes multiple encapsulants and connection members, facilitating efficient electrical connections between the chips.
Career Highlights
Seung Wan Shin has worked with leading companies in the technology sector, including Samsung Electro-Mechanics Co., Ltd. and Samsung Electronics Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.
Collaborations
Throughout his career, Seung Wan Shin has collaborated with talented individuals such as Young Do Kweon and Seung Wook Park. These partnerships have fostered innovation and creativity in their projects.
Conclusion
Seung Wan Shin is a notable inventor whose work in semiconductor packaging has made a significant impact on the industry. His patents reflect his commitment to advancing technology and improving electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile