The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2019
Filed:
Apr. 05, 2018
Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Seung Wan Shin, Suwon-Si, KR;
Seung Chul Oh, Suwon-Si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A fan-out semiconductor package includes: a first semiconductor chip having a first active surface having first connection pads; a first encapsulant encapsulating the first semiconductor chip; a first connection member disposed on the first active surface and including a first redistribution layer electrically connected to the first connection pads; a second semiconductor chip having a second active surface having second connection pads; a second encapsulant covering the first connection member and encapsulating the second semiconductor chip; a second connection member disposed on the second active surface and including a second redistribution layer electrically connected to the second connection pads; and a third via penetrating through the second encapsulant, connecting the first redistribution layer and the second redistribution layer to each other, and including a metal post connected to the first redistribution layer and a via conductor disposed on the metal post and connected to the second redistribution layer.