Suwon, South Korea

Seung On Kang

This inventor holds 5 USPTO granted patents and 5 published patent applications. Top assignees: Samsung Electro-Mechanics Co., Ltd., Samsung Electro-Mechanics, Samsung Electronics Co., Ltd.. Active years: 2017-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seung On Kang. Retrieved from https://idiyas.com/inventor/seung-on-kang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5 

% Patents Active = 80.0

Average Co-Inventor Count = 5.0

ph-index = 2

Forward Citations = 48(Granted Patents)


Company Filing History:


Years Active: 2017-2026

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5 patents (USPTO):Explore Patents

Title: **Innovative Contributions of Seung On Kang in Semiconductor Technology**

Introduction

Seung On Kang, based in Suwon-si, South Korea, is a notable inventor with a strong focus on semiconductor technology. With a total of four patents to his name, Kang has made significant advancements in the field, particularly in the design and functionality of semiconductor packages.

Latest Patents

Among his latest inventions are two noteworthy patents related to semiconductor packages. The first patent describes a semiconductor package that incorporates a semiconductor chip with an active surface featuring a connection pad. Notably, this package includes a heat dissipation member made of a graphite-based material with multiple holes for enhanced thermal management. Additionally, an encapsulant covers portions of both the semiconductor chip and the heat dissipation member, ensuring reliable functionality. The design also features a connection member that includes a redistribution layer connected to the chip's connection pad, optimizing the overall efficiency of the semiconductor package.

The second patent focuses on a fan-out semiconductor package that enhances the performance of semiconductor chips. This invention features a semiconductor chip with a heat dissipation member that has a greater thickness than that of the chip itself, ensuring better heat management. The encapsulation extends over both the chip and the heat dissipation member, while a connection member with redistribution layers is positioned on the active surface of the chip, establishing electrical connections to the connection pads. This innovative package utilizes a complex of carbon and metal for the heat dissipation member, further pushing the boundaries of semiconductor technology.

Career Highlights

Seung On Kang has held pivotal roles in some of the most renowned companies in the technology sector. Notably, he has contributed his expertise at Samsung Electro-Mechanics Co., Ltd. and Samsung Electronics Co., Ltd., where he developed various innovations in semiconductor packaging. His work has significantly impacted the efficiency and reliability of electronic devices across industries.

Collaborations

Throughout his career, Kang has collaborated with talented individuals, including coworkers Han Bit Kim and Woo Sung Han. Their joint efforts have helped to propel advancements in semiconductor technologies, fostering an environment of innovation and creativity within their teams.

Conclusion

Seung On Kang’s contributions to the field of semiconductor technology through his inventive patents showcase his commitment to enhancing electronic functionalities. As the industry continues to evolve, Kang's innovations stand as a testament to his influence and dedication, paving the way for future advancements in the semiconductor realm.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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