Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Seung On Kang

Han Bit Kim

Chul Kyu Kim

Young Gwan Ko

Seong Chan Park

Sang Hyun Kwon

Woo Sung Han

Hyung Kyu Kim

Hye Lee Kim

A semiconductor package includes a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface disposed to oppose the active surface, a heat dissipation member, disposed on the inactive surface of the semiconductor chip, having a plurality of holes and including a graphite-based material, an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member, disposed on the active surface of the semiconductor chip, including a redistribution layer electrically connected to the connection pad. 0&#x3c;b&#x3c;0.6a, in which 'a' denotes a planar area of the heat dissipation member and 'b' denotes a sum of planar areas of the plurality of holes on a plane.

Semiconductor package

A fan-out semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, a heat dissipation member attached to the inactive surface of the semiconductor chip and having a thickness greater than a thickness of the semiconductor chip, an encapsulant encapsulating at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the connection pads, wherein the heat dissipation member is a complex of carbon and a metal.

Fan-out semiconductor package

An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity of the frame, a first metal layer disposed on an inner wall of the cavity of the frame, an encapsulant encapsulating the electronic component, and a redistribution layer disposed below the frame and the electronic component.

Electronic component package and method of manufacturing the same

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Suwon-si, South Korea

Seung On Kang