The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2020
Filed:
Feb. 22, 2019
Samsung Electronics Co., Ltd., Suwon-si, KR;
Seong Chan Park, Suwon-si, KR;
Sang Hyun Kwon, Suwon-si, KR;
Han Kim, Suwon-si, KR;
Hye Lee Kim, Suwon-si, KR;
Seung On Kang, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A fan-out semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, a heat dissipation member attached to the inactive surface of the semiconductor chip and having a thickness greater than a thickness of the semiconductor chip, an encapsulant encapsulating at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the connection pads, wherein the heat dissipation member is a complex of carbon and a metal.