The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2019
Filed:
Aug. 03, 2017
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Seung On Kang, Suwon-si, KR;
Woo Sung Han, Suwon-si, KR;
Young Gwan Ko, Suwon-si, KR;
Chul Kyu Kim, Suwon-si, KR;
Han Kim, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/31 (2006.01); H01L 23/16 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/522 (2006.01); H01L 23/29 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3128 (2013.01); H01L 21/4857 (2013.01); H01L 21/56 (2013.01); H01L 23/16 (2013.01); H01L 23/36 (2013.01); H01L 23/49816 (2013.01); H01L 23/5226 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 23/295 (2013.01); H01L 23/3677 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2924/145 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1438 (2013.01); H01L 2924/14335 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/3511 (2013.01);
Abstract
An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity of the frame, a first metal layer disposed on an inner wall of the cavity of the frame, an encapsulant encapsulating the electronic component, and a redistribution layer disposed below the frame and the electronic component.