Seung Nam Son

Title: Seung Nam Son: Innovator in Semiconductor Packaging

Introduction

Seung Nam Son is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of eight patents. His work focuses on enhancing the efficiency and reliability of semiconductor devices.

Latest Patents

Among his latest patents is a device chip scale package that includes a protective layer and a method of manufacturing it. In one example, this semiconductor device comprises a redistribution layer (RDL) substrate with a top and bottom surface. The RDL substrate is made from a filler-free dielectric material, featuring an electronic device on its top surface and an electrical interconnect on its bottom surface, which is electrically coupled to the electronic device. Additionally, a first protective material contacts the side surface of the electronic device and the top surface of the RDL substrate, while a second protective material contacts the side surface of the electrical interconnect and the bottom surface of the RDL substrate. Other examples and related methods are also disclosed in his patents.

Career Highlights

Seung Nam Son has worked with notable companies in the semiconductor industry, including Amkor Technology Singapore Holding Pte. Ltd. and Amkor Technology, Inc. His experience in these organizations has allowed him to refine his expertise in semiconductor packaging technologies.

Collaborations

He has collaborated with talented individuals such as Won Chul Do and Dong Jin Kim, contributing to advancements in the field through teamwork and shared knowledge.

Conclusion

Seung Nam Son's innovative work in semiconductor packaging has led to multiple patents that enhance device performance and reliability. His contributions continue to impact the industry positively.