Amkor Technology Singapore Holding Pte. Ltd.

Amkor Technology, Inc.

Seung Nam Son

Won Chul Do

Do Hyung Kim

Curtis Michael Zwenger

Jin Han Kim

Jun Hwan Park

Ji Hun Lee

Dong Jin Kim

Hyun Cho

Won Myoung Ki

Dong Hoon Han

Jae Hun Bae

Jae Beom Shim

Tae Ki Kim

Dong Hyun Khim

Jin Kun Yoo

Won Chul Do Do

Jae Hun Bae Bae

In one example, a semiconductor device comprises a redistribution layer (RDL) substrate having a top surface and a bottom surface, wherein the RDL substrate comprises a filler-free dielectric material, an electronic device on the top surface of the RDL substrate, an electrical interconnect on the bottom surface of the RDL substrate and electrically coupled to the electronic device, a first protective material contacting a side surface of the electronic device and the top surface of the RDL substrate, and a second protective material contacting a side surface of the electrical interconnect and the bottom surface of the RDL substrate. Other examples and related methods are also disclosed herein.

Device chip scale package including a protective layer and method of manufacturing a device chip scale package

Device chip scale package including a protective layer

A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

Semiconductor device and manufacturing method thereof

In one example, an electronic device comprises a base substrate comprising a base substrate conductive structure, a first electronic component over a first side of the base substrate, an encapsulant over the first side of the base substrate, wherein the encapsulant contacts a lateral side of the electronic component, an interposer substrate over a first side of the encapsulant and comprising an interposer substrate conductive structure, and a vertical interconnect in the encapsulant and coupled with the base substrate conductive structure and the interposer substrate conductive structure. A first one of the base substrate or the interposer substrate comprises a redistribution layer (RDL) substrate, and a second one of the base substrate or the interposer substrate comprises a laminate substrate. Other examples and related methods are also disclosed herein.

Electronic devices with a redistribution layer and methods of manufacturing electronic devices with a redistribution layer

Electrionic devices with interposer and redistribution layer

Growing community of inventors

Seoul, South Korea

Seung Nam Son