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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11195726 B1

PDFFull Text
Date of Patent:
Dec. 07, 2021

Filed:

Feb. 04, 2020

Semiconductor device and manufacturing method thereof

Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Inventors:

Dong Jin Kim, Gwangju, KR;

Jin Han Kim, Namyangju-si, KR;

Won Chul Do, Seoul, KR;

Jae Hun Bae, Seoul, KR;

Won Myoung Ki, Anyang-si, KR;

Dong Hoon Han, Busan, KR;

Do Hyung Kim, Seongnam-si, KR;

Ji Hun Lee, Seoul, KR;

Jun Hwan Park, Seoul, KR;

Seung Nam Son, Seoul, KR;

Hyun Cho, Yeosu-si, KR;

Curtis Zwenger, Chandler, AZ (US);

Assignee:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Attorney:

McAndrews, Held & Malloy, Ltd.

Primary Examiner:

Yasser A Abdelaziez

Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/49822 (2013.01); H01L 23/5389 (2013.01); H01L 24/92 (2013.01); H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 2221/68304 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68331 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68363 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/131 (2013.01); H01L 2224/133 (2013.01); H01L 2224/13294 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/8191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81224 (2013.01); H01L 2224/81424 (2013.01); H01L 2224/81439 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81464 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81911 (2013.01); H01L 2224/81913 (2013.01); H01L 2224/81914 (2013.01); H01L 2224/83 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83104 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/92 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/14335 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/18161 (2013.01);
Abstract

A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

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