Hwaseong, South Korea

Seung-Duk Baek

This inventor holds 35 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2007-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seung-Duk Baek. Retrieved from https://idiyas.com/inventor/seung-duk-baek

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 35 

% Patents Active = 85.7

Average Co-Inventor Count = 2.9

ph-index = 8

Forward Citations = 546(Granted Patents)


Location History:

  • Asan, KR (2007)
  • Gyeonggi-do, KR (2009 - 2012)
  • Yongin-si, KR (2012)
  • Asan-si, KR (2007 - 2013)
  • Hwaseong-si, KR (2010 - 2024)

Company Filing History:


Years Active: 2007-2024

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Areas of Expertise:
Semiconductor Package
Chip Stack Package
Wafer Level Package
Semiconductor Device
Stack Module
Redistribution Line Structure
Three-Dimensional Module
Decoupling Capacitor
Manufacturing Method
Printed Circuit Board
Semiconductor Memory Device
Through Interconnections
35 patents (USPTO):Explore Patents

Title: Innovations in Semiconductor Technology by Seung-Duk Baek

Introduction

Seung-Duk Baek is a prominent inventor based in Hwaseong-si, South Korea, recognized for his significant contributions to the field of semiconductor technology. With an impressive portfolio of 35 patents, Baek has been a driving force behind many innovations that enhance the performance and efficiency of semiconductor packages.

Latest Patents

His latest innovation is a novel semiconductor package that aims to improve the integration and performance of electronic components. This semiconductor package includes a package substrate, an interposer, a logic chip, at least one memory chip, and a heat sink. The interposer is strategically positioned over the package substrate and is electrically connected to it. The logic chip is placed on top of the interposer, with electrical connections established between them. Additionally, the memory chip is situated above the interposer, also electrically connected to both the interposer and the logic chip. The design incorporates a heat sink that makes thermal contact with the upper surface of the logic chip, effectively dissipating heat generated, thus ensuring optimal performance of the device.

Career Highlights

Baek is currently employed at Samsung Electronics Co., Ltd., a leading global company renowned for its cutting-edge technology and innovation in electronics. His work at Samsung has significantly influenced the development of advanced semiconductor technologies and has established him as a key player in the industry.

Collaborations

Throughout his career, Seung-Duk Baek has collaborated with esteemed colleagues such as Sun-Won Kang and Dong-Hyeon Jang. These partnerships have led to the development of groundbreaking technologies that push the boundaries of semiconductor design and application.

Conclusion

Seung-Duk Baek's innovations in semiconductor packaging exemplify the continuous evolution of technology in the electronics sector. His extensive patent portfolio demonstrates his commitment to advancing semiconductor technology, ultimately contributing to the creation of more efficient and powerful electronic devices. Baek’s work not only benefits his organization but also has a broader impact on the industry, paving the way for future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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