Company Filing History:
1 out of 48 
1 out of 3 
1 out of 106 Years Active: 2008-2010
Title: Seong Kwang Brandon Kim: Innovator in Semiconductor Packaging
Introduction
Seong Kwang Brandon Kim is a notable inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His innovative designs have advanced the technology used in integrated circuits, showcasing his expertise and creativity.
Latest Patents
Among his latest patents is the "Multi-chip ball grid array package and method of manufacture." This patent describes a BGA package that includes a base IC structure with a base substrate featuring an opening running lengthwise through it. A first semiconductor chip is mounted face-down on the base substrate, allowing access to its bond pads through the opening. Additionally, the package incorporates a secondary IC structure with a secondary substrate, which also has an opening. A second semiconductor chip is mounted face-down on this secondary substrate, ensuring that its bond pads are accessible through the opening. An encapsulant fills the opening in the secondary substrate, forming a substantially planar surface that is mounted to the first chip of the base IC structure through an adhesive. Wires connect the conductive portions of both IC structures, enhancing the overall functionality of the package.
Another significant patent is the "Cavity chip package." This invention features a carrier with a cavity formed on one of its major surfaces. Bumps of a semiconductor die are mated to contact pads located at the bottom of the cavity. The die is securely attached to the major surface of the carrier, which provides support and stability during assembly.
Career Highlights
Seong Kwang Brandon Kim has worked with prominent companies in the semiconductor industry, including United Test and Assembly Center Limited and Utac - United Test and Assembly Test Center Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.
Collaborations
Throughout his career, Seong has collaborated with talented individuals such as Henry Iksan and Susanto Tanary. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies in semiconductor packaging.
Conclusion
Seong Kwang Brandon Kim is a distinguished inventor whose work in semiconductor packaging has made a lasting impact on the industry. His patents reflect his innovative spirit and dedication to advancing technology.