The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2010
Filed:
Apr. 02, 2004
Fung Leng Chen, Singapore, SG;
Seong Kwang Brandon Kim, Singapore, SG;
Wee Lim Cha, Singapore, SG;
Yi-sheng Anthony Sun, Singapore, SG;
Wolfgang Hetzel, Nattheim, DE;
Jochen Thomas, Munich, DE;
Fung Leng Chen, Singapore, SG;
Seong Kwang Brandon Kim, Singapore, SG;
Wee Lim Cha, Singapore, SG;
Yi-Sheng Anthony Sun, Singapore, SG;
Wolfgang Hetzel, Nattheim, DE;
Jochen Thomas, Munich, DE;
UTAC - United Test and Assembly Test Center Ltd., Singapore, SG;
Infineon Technologies, Munich, DE;
Abstract
A BGA package is disclosed including a base IC structure having a base substrate, with an opening running length-wise there through. A first semiconductor chip is mounted face-down on the base substrate so the bond pads thereof are accessible through the opening. The package also includes a secondary IC structure including a secondary substrate, having an opening running there through, and a second semiconductor chip. The second chip is mounted face-down on the secondary substrate so that the bond pads thereof are accessible through the opening in the secondary substrate. An encapsulant fills the opening in the secondary substrate and forms a substantially planar surface over the underside of the secondary substrate. The substantially planar surface is mounted to the first chip of the base IC structure through an adhesive. Wires connect a conductive portion of the secondary IC structure to a conductive portion of the base IC structure.