Fung Leng Chen

Title: Innovations of Fung Leng Chen

Introduction

Fung Leng Chen is a notable inventor based in Singapore, recognized for his contributions to the field of integrated circuit packaging. With a total of 2 patents, he has made significant advancements in technology that enhance the efficiency and functionality of electronic devices.

Latest Patents

Fung Leng Chen's latest patents include a Multi-chip ball grid array package and method of manufacture. This innovative BGA package features a base IC structure with a base substrate that has an opening running length-wise through it. A first semiconductor chip is mounted face-down on the base substrate, allowing access to its bond pads through the opening. Additionally, the package includes a secondary IC structure with a secondary substrate, which also has an opening. A second semiconductor chip is mounted face-down on this secondary substrate, ensuring that its bond pads are accessible through the opening. An encapsulant fills the opening in the secondary substrate, creating a substantially planar surface that is adhered to the first chip of the base IC structure. Wires connect the conductive portions of both IC structures, facilitating efficient communication between them.

Another significant patent is the High density internal ball grid array integrated circuit package. This integrated circuit package comprises a substrate with peripheral openings and first and second surfaces. A plurality of routing strips is integral with the substrate, and a number of pads are centrally disposed on the first surface, electrically connected to at least one of the routing strips. A chip with bonding pads is adhered to the second surface of the substrate, with wire bonding connecting at least one bonding pad to the routing strips. Potting material fills the openings to secure the chip to the substrate and surrounds the wire bonding, ensuring durability and reliability.

Career Highlights

Fung Leng Chen has worked with prominent companies in the technology sector, including Utac (United Test and Assembly Center Ltd.) and Infineon Technologies LLC. His experience in these organizations has contributed to his expertise in integrated circuit packaging and semiconductor technology.

Collaborations

Fung has collaborated with talented individuals in his field, including Seong Kwang Brandon Kim and Wee Lim Cha. These partnerships have fostered innovation and the development of cutting-edge technologies.

Conclusion

Fung Leng Chen's contributions to the field of integrated circuit packaging through his patents and collaborations highlight his role as a significant inventor in the technology sector. His work continues to influence advancements