Texas Instruments Corporation

Infineon Technologies LLC

Utac - United Test and Assembly Test Center Ltd.

Fung Leng Chen

Jochen Thomas

Chee Kiang Yew

Wolfgang Hetzel

Pang Hup Ong

Seong Kwang Brandon Kim

Wee Lim Cha

Yi-Sheng Anthony Sun

A BGA package is disclosed including a base IC structure having a base substrate, with an opening running length-wise there through. A first semiconductor chip is mounted face-down on the base substrate so the bond pads thereof are accessible through the opening. The package also includes a secondary IC structure including a secondary substrate, having an opening running there through, and a second semiconductor chip. The second chip is mounted face-down on the secondary substrate so that the bond pads thereof are accessible through the opening in the secondary substrate. An encapsulant fills the opening in the secondary substrate and forms a substantially planar surface over the underside of the secondary substrate. The substantially planar surface is mounted to the first chip of the base IC structure through an adhesive. Wires connect a conductive portion of the secondary IC structure to a conductive portion of the base IC structure.

Multi-chip ball grid array package and method of manufacture

An integrated circuit package ( ) comprising a substrate ( ) having peripheral openings ( ) and first and second surfaces ( ), a plurality of routing strips ( ) being integral with the substrate ( ), a plurality of pads ( ) centrally disposed on the first surface ( ) and electrically connected with at least one of the routing strips ( ), a chip ( ) having bonding pads ( ) adhered to the second surface ( ) of the substrate ( ), wire bonding ( ) electrically connecting at least one bonding pad ( ) to at least one of the routing strips ( ) and potting material ( ) filling the openings ( ) to adhere the chip ( ) to the substrate ( ) and surrounding the wire bonding ( ), is disclosed.

High density internal ball grid array integrated circuit package

Growing community of inventors

Singapore, Singapore

Fung Leng Chen