Company Filing History:
1 out of 3 
1 out of 106 Years Active: 2010
Title: The Innovative Contributions of Wee Lim Cha
Introduction
Wee Lim Cha is a notable inventor based in Singapore, recognized for his contributions to semiconductor technology. His innovative work has led to the development of a unique multi-chip ball grid array (BGA) package, which has significant implications for the electronics industry. With a focus on enhancing the efficiency and functionality of semiconductor devices, Cha's inventions are paving the way for advancements in this field.
Latest Patents
Cha holds a patent for a multi-chip ball grid array package and method of manufacture. This patent describes a BGA package that includes a base integrated circuit (IC) structure with a base substrate featuring an opening running lengthwise through it. A first semiconductor chip is mounted face-down on the base substrate, allowing access to its bond pads through the opening. Additionally, the package incorporates a secondary IC structure with a secondary substrate, which also has an opening. A second semiconductor chip is mounted face-down on this secondary substrate, ensuring that its bond pads are accessible through the opening. An encapsulant fills the opening in the secondary substrate, creating a substantially planar surface that is adhered to the first chip of the base IC structure. Wires connect the conductive portions of both IC structures, facilitating efficient communication between the chips.
Career Highlights
Throughout his career, Wee Lim Cha has worked with prominent companies in the semiconductor industry. He has been associated with Utac, known as United Test and Assembly Center Ltd., and Infineon Technologies LLC. His experience in these organizations has contributed to his expertise in semiconductor packaging and assembly.
Collaborations
Cha has collaborated with notable colleagues in his field, including Fung Leng Chen and Seong Kwang Brandon Kim. These partnerships have likely fostered innovation and the exchange of ideas, further enhancing the development of advanced semiconductor technologies.
Conclusion
Wee Lim Cha's contributions to the field of semiconductor technology, particularly through his patented multi-chip ball grid array package, demonstrate his innovative spirit and commitment to advancing electronic devices. His work continues to influence the industry and inspire future innovations.