The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2008
Filed:
Sep. 28, 2006
Applicants:
Henry Iksan, Tsuen Wan, HK;
Seong Kwang Brandon Kim, Singapore, SG;
Susanto Tanary, Singapore, SG;
Hien Boon Tan, Singapore, SG;
Yi Sheng Anthony Sun, Singapore, SG;
Inventors:
Henry Iksan, Tsuen Wan, HK;
Seong Kwang Brandon Kim, Singapore, SG;
Susanto Tanary, Singapore, SG;
Hien Boon Tan, Singapore, SG;
Yi Sheng Anthony Sun, Singapore, SG;
Assignee:
United Test and Assembly Center Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H11L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A package for an IC includes a carrier with a cavity formed on one of the major surfaces. Bumps of a semiconductor die are mated to contact pads located on the bottom of the cavity. The die is attached to the major surface of the carrier. The major surface creates a support which securely holds the chip in place with adhesive for assembly.