Infineon Technologies LLC

United Test and Assembly Center Limited

Utac - United Test and Assembly Test Center Ltd.

Seong Kwang Brandon Kim

Hien Boon Tan

Jochen Thomas

Wolfgang Hetzel

Yi Sheng Anthony Sun

Susanto Tanary

Fung Leng Chen

Yi-Sheng Anthony Sun

Henry Iksan

Wee Lim Cha

A BGA package is disclosed including a base IC structure having a base substrate, with an opening running length-wise there through. A first semiconductor chip is mounted face-down on the base substrate so the bond pads thereof are accessible through the opening. The package also includes a secondary IC structure including a secondary substrate, having an opening running there through, and a second semiconductor chip. The second chip is mounted face-down on the secondary substrate so that the bond pads thereof are accessible through the opening in the secondary substrate. An encapsulant fills the opening in the secondary substrate and forms a substantially planar surface over the underside of the secondary substrate. The substantially planar surface is mounted to the first chip of the base IC structure through an adhesive. Wires connect a conductive portion of the secondary IC structure to a conductive portion of the base IC structure.

Multi-chip ball grid array package and method of manufacture

A package for an IC includes a carrier with a cavity formed on one of the major surfaces. Bumps of a semiconductor die are mated to contact pads located on the bottom of the cavity. The die is attached to the major surface of the carrier. The major surface creates a support which securely holds the chip in place with adhesive for assembly.

Cavity chip package

Growing community of inventors

Singapore, Singapore

Seong Kwang Brandon Kim