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For the Inventor, By the Inventor

Suwon-si, South Korea

Seong Jong Cheon

USPTO Granted Patents = 22 

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 16(Granted Patents)


Company Filing History:

goldMedal22 out of 7,574 
 
Samsung Electro-mechanics Co., Ltd.
 patents

Years Active: 2018-2023

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22 patents (USPTO):Explore Patents
1. 11658393 - Electronic device with radio-frequency module (2023-05-23),
2. 11539138 - Chip radio frequency package and radio frequency module (2022-12-27),
3. 11502710 - Front-end module (2022-11-15),
4. 11496107 - Frontend module (2022-11-08),
5. 11387556 - Frontend module (2022-07-12),
6. 11335991 - Electronic device with radio-frequency module (2022-05-17),
7. 11183765 - Chip radio frequency package and radio frequency module (2021-11-23),
8. 11159147 - Front end module (2021-10-26),
9. 11133592 - Chip radio frequency package and radio frequency module (2021-09-28),
10. 11101840 - Chip radio frequency package and radio frequency module (2021-08-24),
11. 11025218 - Frontend module (2021-06-01),
12. 10951195 - Acoustic resonator filter package (2021-03-16),
13. 10931254 - Front end module (2021-02-23),
14. 10784839 - High pass filter (2020-09-22),
15. 10749493 - Band pass filter (2020-08-18),

Title: Seong Jong Cheon: A Pioneer in Radio-Frequency Innovations

Introduction

Seong Jong Cheon, based in Suwon-si, South Korea, is an accomplished inventor with a remarkable portfolio of 22 patents. His contributions to the field of electronic devices, particularly in radio-frequency technology, have positioned him as a key player at Samsung Electro-Mechanics Co., Ltd.

Latest Patents

Among his latest innovations, Seong has developed several groundbreaking patents that enhance the functionality and efficiency of electronic devices:

1. **Electronic Device with Radio-Frequency Module**: This patent introduces a radio-frequency device that incorporates a radio-frequency module comprised of a first substrate, a second substrate, an RF integrated circuit (RFIC), a front-end integrated circuit (FEIC), and a flexible substrate. The architecture ensures the RFIC effectively manages input and output signals while allowing for a flexible interconnection between components.

2. **Chip Radio Frequency Package and Radio Frequency Module**: This patent details a chip radio-frequency package that features a substrate with a first cavity and connection members, an RFIC on its surface, and a FEIC within the cavity. This design facilitates improved signaling between components, optimizing both performance and reliability.

Career Highlights

Seong Jong Cheon’s career at Samsung Electro-Mechanics Co., Ltd. has been marked by a strong focus on advancing radio-frequency technologies. His innovative approach to integrating essential electronic components has been pivotal in the development of high-performance devices that meet the growing demands of the tech industry.

Collaborations

Working alongside esteemed colleagues such as Young Sik Hur and Hak Gu Kim, Seong has collaborated on numerous projects that leverage their collective expertise in the field, fostering a culture of innovation and excellence at their company.

Conclusion

Seong Jong Cheon's contributions to the field of radio-frequency technology exemplify his dedication to innovation and invention. With 22 patents to his name, his continued work at Samsung Electro-Mechanics Co., Ltd. promises to further revolutionize the electronic device landscape.

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