The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Jul. 20, 2020
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Kang Ta Jo, Suwon-si, KR;

Seong Jong Cheon, Suwon-si, KR;

Se Jong Kim, Suwon-si, KR;

Ho Taek Song, Suwon-si, KR;

Jang Ho Park, Suwon-si, KR;

Yoo Sam Na, Suwon-si, KR;

Jae Hyouck Choi, Suwon-si, KR;

Young Sik Hur, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/10 (2006.01); H01Q 1/38 (2006.01); H04B 1/04 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H04B 1/1018 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H04B 1/04 (2013.01);
Abstract

A front-end module includes: a substrate including a first connection member in which at least one first insulating layer and at least one first wiring layer are alternately stacked, a second connection member in which at least one second insulating layer and at least one second wiring layer are alternately stacked, and a core member disposed between the first and second connection members; a radio-frequency component mounted on a surface of the substrate and configured to amplify a main band of an input RF signal or filter bands outside the main band; an inductor disposed on a surface of the core member and electrically connected to the radio-frequency component; and a ground plane disposed on another surface of the core member. The core member includes a core insulating layer thicker than an insulating layer among at least one first insulating layer and the at least one second insulating layer.


Find Patent Forward Citations

Loading…