Seongnam, South Korea

Senug-Hyun Ra

This inventor holds 3 USPTO granted patents. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2010-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Senug-Hyun Ra. Retrieved from https://idiyas.com/inventor/senug-hyun-ra

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 4.2

ph-index = 1

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 2010-2012

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3 patents (USPTO):Explore Patents

Title: Innovations of Senug-Hyun Ra in Printed Circuit Board Technology

Introduction

Senug-Hyun Ra is a notable inventor based in Seongnam, South Korea. He has made significant contributions to the field of printed circuit board (PCB) technology, holding a total of 3 patents. His work focuses on innovative methods for manufacturing PCBs that enhance their efficiency and integration.

Latest Patents

One of his latest patents is a method for manufacturing printed circuit boards using imprinting. This method involves selectively marking an oxidant capable of polymerizing conductive polymers on a board. The monomer of a conductive polymer is then filled in the selected pattern and polymerized, resulting in a conductive polymer wiring pattern. This technique allows for finer wiring widths, enabling the production of highly integrated and efficient printed circuit boards. The method is applicable to various electronic products, including industrial, clerical, and domestic devices.

Another significant patent by Senug-Hyun Ra is a method for manufacturing substrates by imprinting. This process enhances the release property between a resin layer and an imprinting mold by utilizing a metal thin film layer. The method involves laminating a metal thin film layer on top of a resin layer, pressurizing them with an imprinting mold, curing the resin, and then removing the mold. This innovative approach is advantageous for forming conductive layers through plating.

Career Highlights

Senug-Hyun Ra is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to develop cutting-edge technologies in the field of electronics. His work has contributed to advancements in PCB manufacturing processes, making them more efficient and effective.

Collaborations

Throughout his career, Senug-Hyun Ra has collaborated with esteemed colleagues, including Choon-Keun Lee and Myeong-Ho Hong. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Senug-Hyun Ra's contributions to the field of printed circuit board technology are noteworthy. His innovative methods for manufacturing PCBs and substrates have the potential to revolutionize the electronics industry. His work exemplifies the importance of innovation in advancing technology and improving product efficiency.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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