The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2012
Filed:
Mar. 05, 2007
Choon-keun Lee, Suwon-si, KR;
Myeong-ho Hong, Suwon-si, KR;
Seung-heon Han, Seoul, KR;
Senug-hyun Ra, Seongnam-si, KR;
Choon-Keun Lee, Suwon-si, KR;
Myeong-Ho Hong, Suwon-si, KR;
Seung-Heon Han, Seoul, KR;
Senug-Hyun Ra, Seongnam-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
While releasing property between a resin layer and an imprinting mold is given by using a metal thin film layer, a method for manufacturing a substrate advantageous for forming a conductive layer by plating and a substrate manufactured by the method are provided. According to one aspect of the present invention, a method for manufacturing a substrate by imprinting, the method comprising: laminating a metal thin film layer on top of a resin layer; pressurizing the resin layer and the metal thin film layer by an imprinting mold which comprises a side having a pattern in correspondence with a wiring pattern; curing a resin which forms the resin layer; and removing the imprinting mold from the resin layer and the metal thin film layer, may be presented.