The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7653990 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 02, 2010

Filed:

Apr. 13, 2007
Applicants:

Choon-keun Lee, Suwon-si, KR;

Myeong-ho Hong, Suwon-si, KR;

Senug-hyun Ra, Seongnam-si, KR;

Inventors:

Choon-Keun Lee, Suwon-si, KR;

Myeong-Ho Hong, Suwon-si, KR;

Senug-Hyun Ra, Seongnam-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/10 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A manufacturing method of printed circuit board print is disclosed. A method of manufacturing a PCB which includes providing an imprinting stamper with a relievo pattern formed in correspondence with a circuit pattern data using the circuit pattern data, forming an intaglio pattern corresponding to the relievo pattern by pressing the imprinting stamper on an insulation layer, and forming a circuit pattern by printing conductive ink in the intaglio pattern by an ink-jet method using the circuit pattern data, allows the forming of a circuit pattern to a required thickness by injecting conductive ink in a groove processed by the imprint method, and prevents the spreading of ink and the distortion of the pattern shape in the curing process for conductive ink containing metal Also, the circuit pattern CAD data used in the manufacturing of an imprinting stamper can be utilized again in the ink-jet printing process.


Find Patent Forward Citations

Lee, Choon-Keun. (2010). Manufacturing method of printed circuit board using an ink jet (U.S. Patent No. 7653990). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7653990

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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