The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8216503 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 10, 2012

Filed:

Jun. 28, 2007
Applicants:

Jae-choon Cho, Suwon-si, KR;

Myeong-ho Hong, Suwon-si, KR;

Senug-hyun Ra, Seongnam-si, KR;

Hyuk-soo Lee, Seongnam-si, KR;

Jeong-bok Kwak, Suwon-si, KR;

Jung-woo Lee, Gunpo-si, KR;

Choon-keun Lee, Suwon-si, KR;

Sang-moon Lee, Seoul, KR;

Inventors:

Jae-Choon Cho, Suwon-si, KR;

Myeong-Ho Hong, Suwon-si, KR;

Senug-Hyun Ra, Seongnam-si, KR;

Hyuk-Soo Lee, Seongnam-si, KR;

Jeong-Bok Kwak, Suwon-si, KR;

Jung-Woo Lee, Gunpo-si, KR;

Choon-Keun Lee, Suwon-si, KR;

Sang-Moon Lee, Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); B28B 3/00 (2006.01); B29C 59/02 (2006.01); B05D 3/04 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for manufacturing a printed circuit board, in which an oxidant capable of polymerizing conductive polymers is selectively marked on a board using imprinting, and the monomer of a conductive polymer is filled in the selected pattern and polymerized, to provide a conductive polymer wiring pattern. With the method for manufacturing a printed circuit board, a printed circuit board can be given finer wiring widths to allow a highly integrated, highly efficient printed circuit board. Thus, a printed circuit board (PCB) or a flexible printed circuit boards (FPCB) can be manufactured that is applicable to industrial, clerical, and domestic electric electronic products, by forming conductive polymer wiring using imprinting.


Find Patent Forward Citations

Cho, Jae-Choon. (2012). Method for manufacturing printed circuit board using imprinting (U.S. Patent No. 8216503). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8216503

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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