The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2012
Filed:
Jun. 28, 2007
Jae-choon Cho, Suwon-si, KR;
Myeong-ho Hong, Suwon-si, KR;
Senug-hyun Ra, Seongnam-si, KR;
Hyuk-soo Lee, Seongnam-si, KR;
Jeong-bok Kwak, Suwon-si, KR;
Jung-woo Lee, Gunpo-si, KR;
Choon-keun Lee, Suwon-si, KR;
Sang-moon Lee, Seoul, KR;
Jae-Choon Cho, Suwon-si, KR;
Myeong-Ho Hong, Suwon-si, KR;
Senug-Hyun Ra, Seongnam-si, KR;
Hyuk-Soo Lee, Seongnam-si, KR;
Jeong-Bok Kwak, Suwon-si, KR;
Jung-Woo Lee, Gunpo-si, KR;
Choon-Keun Lee, Suwon-si, KR;
Sang-Moon Lee, Seoul, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A method for manufacturing a printed circuit board, in which an oxidant capable of polymerizing conductive polymers is selectively marked on a board using imprinting, and the monomer of a conductive polymer is filled in the selected pattern and polymerized, to provide a conductive polymer wiring pattern. With the method for manufacturing a printed circuit board, a printed circuit board can be given finer wiring widths to allow a highly integrated, highly efficient printed circuit board. Thus, a printed circuit board (PCB) or a flexible printed circuit boards (FPCB) can be manufactured that is applicable to industrial, clerical, and domestic electric electronic products, by forming conductive polymer wiring using imprinting.