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For the Inventor, By the Inventor

Chiba, Japan

Seiji Ishikawa

This inventor holds 10 USPTO granted patents. Top assignees: Ube Industries, Inc., Seibu Oil Co., Ltd.. Active years: 1979-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seiji Ishikawa. Retrieved from https://idiyas.com/inventor/seiji-ishikawa-tp7ttbli

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10

% Patents Active = 80.0

Average Co-Inventor Count = 3.4

ph-index = 5

Forward Citations = 57(Granted Patents)


Location History:

  • Ichihara, JP (1979 - 2002)
  • Ube, JP (2002)
  • Chiba, JP (1988 - 2012)

Company Filing History:

goldMedal10 out of 1,432 
 
Ube Industries, Inc.
 patents
silverMedal1 out of 2 
 
Seibu Oil Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 1979-2012

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10 patents (USPTO):Explore Patents
1. 8124173 - Process for packaging electronic devices (2012-02-28),
2. 6929856 - Dicing tape (2005-08-16),
3. 6468639 - Single-application polyimidosiloxane-based coating material and cured film (2002-10-22),
4. 6461738 - Polyimide-based insulating film composition, insulating film and insulating film-forming method (2002-10-08),
5. 6117510 - Adhesive-applied tape (2000-09-12),
6. 6096480 - Photosensitive polyimidosiloxane compositions and insulating films made (2000-08-01),
7. 5643986 - Polyimidosiloxane compositions (1997-07-01),
8. 4759839 - Process for producing pitch useful as raw material for carbon fibers (1988-07-26),
9. 4373087 - O-Tolidine sulfone based copolyamide fiber (1983-02-08),
10. 4178431 - Aromatic copolyamide fiber from benzidine sulfone or diamino (1979-12-11),

Title: Seiji Ishikawa: Innovator in Electronic Device Packaging

Introduction

Seiji Ishikawa is a prominent inventor based in Chiba, Japan. He has made significant contributions to the field of electronic device packaging, holding a total of 10 patents. His innovative approaches have paved the way for advancements in the industry.

Latest Patents

One of his latest patents is a process for packaging electronic devices. This process employs an insulating protective resin layer produced from various resin compositions. These compositions include an organic solvent-soluble resin with a polysiloxane skeleton and a polar group, combined with epoxy compounds and organic solvents. Another notable patent is for dicing tape, which features a tackifiable adhesive layer primarily composed of polyimide. This tape exhibits high adhesive strength with silicon wafers and circuit boards, addressing the challenges posed by low tacky strength at room temperature.

Career Highlights

Throughout his career, Seiji Ishikawa has worked with notable companies such as Ube Industries, Inc. and Seibu Oil Co., Ltd. His experience in these organizations has contributed to his expertise in developing innovative packaging solutions for electronic devices.

Collaborations

Seiji has collaborated with esteemed colleagues, including Hiroshi Yasuno and Shigeru Yamamoto. These partnerships have further enhanced his work and contributed to the success of his inventions.

Conclusion

Seiji Ishikawa's contributions to electronic device packaging demonstrate his innovative spirit and dedication to advancing technology. His patents reflect a deep understanding of materials and processes that are essential for the future of the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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