The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2012
Filed:
Dec. 08, 2008
Masahiro Naiki, Yamaguchi, JP;
Masayuki Kinouchi, Yamaguchi, JP;
Seiji Ishikawa, Chiba, JP;
Yuji Matsui, Yamaguchi, JP;
Yoshiki Tanaka, Yamaguchi, JP;
Masahiro Naiki, Yamaguchi, JP;
Masayuki Kinouchi, Yamaguchi, JP;
Seiji Ishikawa, Chiba, JP;
Yuji Matsui, Yamaguchi, JP;
Yoshiki Tanaka, Yamaguchi, JP;
UBE Industries, Ltd., Ube-shi, Yamaguchi, JP;
Abstract
A process for packaging an electronic device employs an insulating protective resin layer produced from one or more of the resin compositions: (1) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.5 to 30 parts of an epoxy compound having an epoxy equivalent of more than 800, and an organic solvent, (2) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 10 parts of an epoxy compound having an epoxy equivalent of 100 to 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent; and (3) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 20 parts of an epoxy compound having an epoxy equivalent of more than 800, 2 to 30 parts of a polyvalent isocyanate compound, and an organic solvent.