The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2005

Filed:

Jul. 28, 2003
Applicants:

Seiji Ishikawa, Chiba, JP;

Koji Hayashi, Ube, JP;

Kenji Sonoyama, Ube, JP;

Inventors:

Seiji Ishikawa, Chiba, JP;

Koji Hayashi, Ube, JP;

Kenji Sonoyama, Ube, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B007/12 ;
U.S. Cl.
CPC ...
Abstract

Dicing tape comprises a tackifiable adhesive layer which is composed mainly of a polyimide and has a peel strength of 0.02 N/mm (20 gf/cm) or greater as the adhesive strength at near room temperature (20-50° C.) and a cured peel strength of 0.3 N/mm (300 gf/cm) or greater. The tape exhibits adhesive strength with silicon wafers sufficiently high to allow dicing at near room temperature, and also exhibits high adhesive strength with circuit boards after curing, in light of the processing disadvantages of polyimide-based dicing tape resulting from its low tacky strength (initial adhesive strength) at low temperatures of around room temperature, which requires a higher ambient temperature to increase the adhesive force and thus necessitates supplementary heating equipment.


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