The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 1997

Filed:

Mar. 14, 1996
Applicant:
Inventors:

Seiji Ishikawa, Ichihara, JP;

Hiroshi Yasuno, Ichihara, JP;

Masayuki Nakatani, Ichihara, JP;

Hiroyuki Fukuda, Ichihara, JP;

Shigeru Yamamoto, Ichihara, JP;

Assignee:

Ube Industries, Ltd., Yamaguchi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K / ;
U.S. Cl.
CPC ...
524366 ; 524 99 ; 524104 ; 524167 ; 524173 ; 524211 ; 524351 ; 524352 ; 524356 ; 524379 ; 524386 ; 524367 ; 524233 ; 524449 ; 524423 ; 525423 ; 525476 ; 528 26 ; 528 28 ; 528 38 ;
Abstract

A composition containing 100 parts by weight of a soluble polyimidosiloxane obtained by polymerization and imidation of an aromatic tetracarboxylic acid component and a component comprising a diaminopolysiloxane, an aromatic diamine with a hydroxyl group and optionally another aromatic diamine, 1 to 50 parts by weight of an epoxy resin, and optionally, also 2 to 150 parts by weight of an inorganic filler such as mica, silica or barium sulfate, and an organic solvent. The composition is homogeneously soluble in organic solvents, and when formed into a protective film on a flexible wiring board it has high heat resistance, flexing resistance, adhesion and chemical resistance (against soldering flux and tin plating solutions).


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