Se-Yong Oh

Title: Se-Yong Oh: Innovator in Wafer Level Stack Structures

Introduction

Se-Yong Oh is a notable inventor based in Yongin-si, South Korea, renowned for his contributions to the field of semiconductor packaging. With a total of nine patents to his name, he has made significant strides in developing advanced system-in-package technologies.

Latest Patents

Among his latest inventions is a patented design for a wafer level stack structure aimed at enhancing system-in-package (SiP) functionality. This innovation includes at least one first device chip featuring a plurality of input/output (I/O) pads, paired with a second device chip that also has its own I/O pads, all mounted on a common circuit board. The unique aspect of this design lies in the differing sizes of the first and second device regions, contributing to improved operational efficiency. Another patent focuses on the method of forming such a wafer level stack structure, detailing steps from chip formation to the stacking process.

Career Highlights

Se-Yong Oh is currently affiliated with Samsung Electronics Co., Ltd., where he has leveraged his expertise to innovate in semiconductor technologies. His work has significantly influenced the development of modern electronic devices, particularly in the realm of packaging solutions.

Collaborations

Throughout his career, Se-Yong has collaborated with esteemed colleagues such as Kang-Wook Lee and Young-Hee Song. Together, they have furthered research in semiconductor technologies, fostering an environment of innovation and teamwork at Samsung.

Conclusion

Se-Yong Oh stands out as an inventive force in the semiconductor industry, with his patented technologies paving the way for future advancements in system-in-package solutions. His achievements reflect a commitment to innovation that continues to impact the electronics landscape.