The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2008
Filed:
Mar. 11, 2005
Sang-hyeop Lee, Chungcheongnam-do, KR;
Se-yong OH, Gyeonggi-do, KR;
Jin-ho Kim, Chungcheongnam-do, KR;
Chan-suk Lee, Chungcheongnam-do, KR;
Min-keun Kwak, Chungcheongnam-do, KR;
Sung-hwan Yoon, Chungcheongnam-do, KR;
Tae-duk Nam, Chungcheongnam-do, KR;
Sang-Hyeop Lee, Chungcheongnam-do, KR;
Se-Yong Oh, Gyeonggi-do, KR;
Jin-Ho Kim, Chungcheongnam-do, KR;
Chan-Suk Lee, Chungcheongnam-do, KR;
Min-Keun Kwak, Chungcheongnam-do, KR;
Sung-Hwan Yoon, Chungcheongnam-do, KR;
Tae-Duk Nam, Chungcheongnam-do, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
The present invention provides an LOC package wherein the lead frame is in direct contact with the semiconductor device. The lead frame, which includes openings, is positioned directly on the semiconductor device. An adhesive material is applied in the opening in the lead frame. This adhesive material contacts both the lead frame and the semiconductor device. The lead frame is therefore securely held to the semiconductor device. Wires can then be bonded to contact pads on the semiconductor device and to the lead frame.