The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2012
Filed:
Jul. 26, 2010
Kang-wook Lee, Suwon-si, KR;
Se-yong OH, Yongin-si, KR;
Young-hee Song, Yongin-si, KR;
Gu-sung Kim, Seongnam-si, KR;
Kang-Wook Lee, Suwon-si, KR;
Se-Yong Oh, Yongin-si, KR;
Young-Hee Song, Yongin-si, KR;
Gu-Sung Kim, Seongnam-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A system-in-package, comprising a wafer level stack structure, including at least one first device chip including a first device region having a plurality of input/output(I/O) pads, and at least one second device chip including a second device region having a plurality of input/output(I/O) pads and a second peripheral region surrounding the second device region, wherein the size of the second device region is different from the size of the first device region, wherein the at least one first device chip and the at least one second device chip have approximately equal size; and a common circuit board to which the wafer level stack structure is connected.