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For the Inventor, By the Inventor

Bend, OR, United States of America

Scot A Kellar

USPTO Granted Patents = 14 

 

Average Co-Inventor Count = 2.4

ph-index = 9

Forward Citations = 2,964(Granted Patents)


Company Filing History:

goldMedal14 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2003-2018

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14 patents (USPTO):Explore Patents
1. 10068866 - Integrated circuit package having rectangular aspect ratio (2018-09-04),
2. 7271434 - Capacitor with insulating nanostructure (2007-09-18),
3. 7265406 - Capacitor with conducting nanostructure (2007-09-04),
4. 7244983 - Method and device for on-chip decoupling capacitor using nanostructures as bottom electrode (2007-07-17),
5. 7157787 - Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices (2007-01-02),
6. 7091084 - Ultra-high capacitance device based on nanostructures (2006-08-15),
7. 7056807 - Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack (2006-06-06),
8. 7037804 - Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integration (2006-05-02),
9. 6975016 - Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof (2005-12-13),
10. 6911373 - Ultra-high capacitance device based on nanostructures (2005-06-28),
11. 6887769 - Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same (2005-05-03),
12. 6762076 - Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices (2004-07-13),
13. 6661085 - Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack (2003-12-09),
14. 6599808 - Method and device for on-chip decoupling capacitor using nanostructures as bottom electrode (2003-07-29),

Title: Scot A Kellar: Innovator in Integrated Circuit Technology

Introduction

Scot A Kellar is a prominent inventor based in Bend, OR (US), known for his significant contributions to the field of integrated circuit technology. With a total of 14 patents to his name, Kellar has made remarkable advancements that have influenced modern electronics.

Latest Patents

Among his latest innovations is the patent for an integrated circuit package having a rectangular aspect ratio. This invention features a packaging arrangement for surface mounting of integrated circuits (ICs), encapsulating one or more IC dies within a package body that has a distinct length and width dimension. Additionally, the package includes leadless surface-mount electrical contacts, strategically situated in clusters at opposite ends of the length dimension of the IC body. Another notable patent is for a capacitor with an insulating nanostructure. This invention outlines a method that involves providing a substrate, forming a lower conductor, and creating a conducting nanostructure, followed by a thin dielectric and an upper conductor.

Career Highlights

Scot A Kellar is currently employed at Intel Corporation, where he continues to push the boundaries of technology through his innovative work. His expertise in integrated circuits and nanostructures has positioned him as a key player in the advancement of electronic components.

Collaborations

Kellar has collaborated with several talented individuals in his field, including Sarah E Kim and R Scott List. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Scot A Kellar's contributions to integrated circuit technology and his impressive portfolio of patents highlight his role as a leading inventor in the electronics industry. His work continues to shape the future of technology and innovation.

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