The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2018
Filed:
Sep. 29, 2016
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Scot A Kellar, Bend, OR (US);
Darren S Crews, Hillsboro, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 21/56 (2013.01); H01L 23/3114 (2013.01); H01L 24/11 (2013.01); H01L 2224/1413 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/3511 (2013.01);
Abstract
An integrated circuit (IC) packaging arrangement for surface mounting of the IC includes a package body that encapsulates one or more IC dies. The package body according to some embodiments has rectangular aspect ratio with a length dimension and a width dimension of different size. The IC packaging according to some embodiments includes leadless surface-mount electrical contacts. According to some embodiments, the leadless surface-mount contacts are situated in clusters at opposite ends of the length dimension of the IC body.