Tokyo, Japan

Sayaka Tsuchiyama

USPTO Granted Patents = 3 

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2016-2018

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3 patents (USPTO):Explore Patents

Title: Sayaka Tsuchiyama: Innovator in Adhesive Technologies

Introduction

Sayaka Tsuchiyama is a prominent inventor based in Tokyo, Japan. She has made significant contributions to the field of adhesive technologies, particularly in the semiconductor industry. With a total of 3 patents to her name, her work has garnered attention for its innovative approaches and practical applications.

Latest Patents

Tsuchiyama's latest patents include an adhesive composition, an adhesive sheet, and a method for producing semiconductor devices. The adhesive composition features an acrylic polymer with a weight-average molecular weight of 350,000 or higher, which is obtained through living radical polymerization using an organotellurium-containing compound as the polymerization initiator. This composition, combined with an epoxy thermosetting resin and a thermosetting agent, provides sufficient adhesive strength and high package reliability in semiconductor devices. Additionally, her work on an adhesive sheet and a production method for semiconductor devices further showcases her expertise in creating effective adhesive solutions.

Career Highlights

Sayaka Tsuchiyama is currently employed at Lintec Corporation, where she continues to develop innovative adhesive technologies. Her career is marked by a commitment to advancing the field and improving the reliability of semiconductor devices through her research and inventions.

Collaborations

Tsuchiyama collaborates with her coworker, Isao Ichikawa, to enhance the development of adhesive technologies. Their teamwork exemplifies the importance of collaboration in driving innovation within the industry.

Conclusion

Sayaka Tsuchiyama's contributions to adhesive technologies have made a significant impact in the semiconductor field. Her innovative patents and dedication to research continue to shape the future of adhesive applications.

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