The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2018
Filed:
Aug. 01, 2014
Applicant:
Lintec Corporation, Tokyo, JP;
Inventors:
Sayaka Tsuchiyama, Tokyo, JP;
Isao Ichikawa, Tokyo, JP;
Assignee:
LINTEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 133/00 (2006.01); C09J 163/00 (2006.01); C09J 175/04 (2006.01); H01L 21/683 (2006.01); C09J 133/06 (2006.01); H01L 23/00 (2006.01); C08G 18/80 (2006.01); C08L 33/06 (2006.01); C09J 7/22 (2018.01); C09J 7/30 (2018.01); C08F 220/20 (2006.01);
U.S. Cl.
CPC ...
C09J 133/00 (2013.01); C08G 18/8022 (2013.01); C08L 33/06 (2013.01); C09J 7/22 (2018.01); C09J 7/30 (2018.01); C09J 133/066 (2013.01); C09J 163/00 (2013.01); C09J 175/04 (2013.01); H01L 21/6836 (2013.01); H01L 24/29 (2013.01); C08F 220/20 (2013.01); C08G 2170/40 (2013.01); C09J 2203/326 (2013.01); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); H01L 24/83 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68336 (2013.01); H01L 2221/68377 (2013.01); H01L 2224/2919 (2013.01);
Abstract
An adhesive composition includes an acrylic polymer (A) having a weight-average molecular weight (Mw) of 350,000 or higher obtained by polymerizing an acrylic monomer by living radical polymerization using an organotellurium-containing compound as the polymerization initiator, an epoxy thermosetting resin (B), and a thermosetting agent (C). The adhesive composition is capable of joining with sufficient adhesive strength and capable of achieving high package reliability in a semiconductor device.