The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2016
Filed:
Mar. 15, 2013
Applicant:
Lintec Corporation, Tokyo, JP;
Inventors:
Sayaka Tsuchiyama, Tokyo, JP;
Isao Ichikawa, Tokyo, JP;
Assignee:
LINTEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/30 (2006.01); B32B 27/38 (2006.01); C09J 133/08 (2006.01); C09J 133/10 (2006.01); C09J 133/14 (2006.01); H01L 21/784 (2006.01); H01L 23/14 (2006.01); C09J 133/00 (2006.01); H01L 21/78 (2006.01); H01L 21/683 (2006.01); B32B 17/10 (2006.01); C09J 163/00 (2006.01); C09J 133/06 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
C09J 133/00 (2013.01); B32B 17/10697 (2013.01); B32B 17/10733 (2013.01); B32B 17/10743 (2013.01); C09J 133/066 (2013.01); C09J 133/08 (2013.01); C09J 133/10 (2013.01); C09J 163/00 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 23/293 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 24/94 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68336 (2013.01); H01L 2221/68377 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2949 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/83 (2013.01); H01L 2224/83048 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83907 (2013.01); H01L 2224/92 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/94 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/181 (2013.01); Y10T 428/2826 (2015.01);
Abstract
An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having unsaturated hydrocarbon group, and a filler (C) having reactive double bond on a surface.