Satoshi Kurokawa

Title: Innovations by Satoshi Kurokawa: Pioneering Package Substrate Designs

Introduction

Satoshi Kurokawa is a distinguished inventor based in Ogaki, Japan, known for his significant contributions in the field of package substrate technology. With a total of six patents to his name, Kurokawa continuously pushes the boundaries of innovation and design in the electronics industry.

Latest Patents

One of Kurokawa's latest patents is focused on a unique package substrate and a method for manufacturing it. This innovative substrate includes an inner interlayer, a first conductor layer, a second conductor layer, an outermost interlayer, and an outermost conductor layer featuring both first and second pads for mounting electronic components. Notably, the design incorporates vias that function to connect these intricate layers, ensuring optimal connectivity. The patent emphasizes the importance of maintaining insulation distances (t, t) to improve performance, defining them as being in the range of 40μm or less to 10μm or more, with a critical difference of less than 5μm.

Another patent by Kurokawa describes a similar package substrate and method for its manufacturing. This version utilizes interlayer insulating layers, which consist of both outermost and inner-layer components, along with conductor layers strategically laid out to enhance efficiency. The outermost conductor layer plays a crucial role by presenting first and second pads for electronic component mounting while optimizing connection through first and second conductors.

Career Highlights

Kurokawa's career is marked by his role at Ibiden Company Limited, where he applies his expertise in developing advanced substrate technologies. His work demonstrates a commitment to enhancing electronic design, which is pivotal in the rapidly evolving tech landscape.

Collaborations

Over the years, Kurokawa has collaborated with notable professionals in his field, including Yasushi Inagaki and Yasuhiro Takahashi, strengthening his approach to innovation and development. These collaborations highlight the importance of teamwork in achieving groundbreaking advancements within the electronics industry.

Conclusion

Satoshi Kurokawa's contributions to the realm of package substrates reflect his innovative spirit and dedication to excellence. His patents not only represent technological ingenuity but also serve as a foundation for future developments in electronic components. As he continues to work at Ibiden Company Limited, the impact of his inventions is likely to resonate within the industry for years to come.