The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2017
Filed:
May. 07, 2015
Ibiden Co., Ltd., Ogaki-shi, JP;
IBIDEN CO., LTD., Ogaki-shi, JP;
Abstract
A package substrate includes an inner interlayer, a first conductor layer, a second conductor layer, an outermost interlayer, an outermost conductor layer including first and second pads to mount electronic components, vias including first and second vias such that the first vias are connecting the first conductor layer and first pads and the second vias are connecting the first conductor layer and second pads, and skip vias penetrating through the outermost and inner interlayers such that the skip vias are connecting the outermost and second conductor layers. Sum of insulation distances (t, t) is in range of 40 μm or less to 10 μm or more, where the insulation distance (t) is insulation distance between the outermost and first conductor layers and the insulation distance (t) is insulation distance between the first and second conductor layers, and difference between the insulation distances (t, t) is less than 5 μm.